Funding
HP CEO makes statement on CHIPS Award
August 28, 2024
HP announced that it has signed preliminary terms for a proposed $50 million (€45 million) award from the US Department of Commerce from the CHIPS and Science Act in support of its microfluidics semiconductor fab in Corvallis, Oregon.
Epson participates in incubation programme at the University of Tokyo
October 12, 2021
Seiko Epson Corporation, through its subsidiary Epson X Investment Corporation, participated as a partner in 1st Round, an incubation programme sponsored by UTokyo Innovation Platform Co., Ltd. (UTokyo IPC).
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