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Katun and winwin announce expanded partnership

Katun Corporation (Katun) announced an expanded partnership with Germany-based office and IT communications organization, winwin Office Network AG.

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HP CEO makes statement on CHIPS Award

HP CEO makes statement on CHIPS Award

HP announced that it has signed preliminary terms for a proposed $50 million (€45 million) award from the US Department of Commerce from the CHIPS and Science Act in support of its microfluidics semiconductor fab in Corvallis, Oregon.

Officeworks partners with YINDI

Officeworks partners with YINDI

Officeworks is expanding its range of office supplies by partnering with Yindi Manufacturing, an Indigenous Australian company dedicated to creating exceptional office furniture and plastics.

Brother receives Technical Packaging Award

Brother receives Technical Packaging Award

Brother Industries, Ltd. announced that it submitted its newly designed small and lightweight molded pulp cushioning material to the Japan Packaging Contest 2024, organised by the Japan Packaging Institute, and has won the Technical Packaging Award.

Xerox and HCLTech extend agreement

Xerox and HCLTech extend agreement

HCLTech announced an extension of its strategic AI-driven Engineering services and Digital Process Operations (DPO) partnership with Xerox.

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